Microstepping driver too easy.

[bunalmis]

Making unipolar microstepper driver now too simple.

What you want? How much amper, how much volts ? Which microstep number?

Don't worry by MCR1207 hybrid.

1) Design step.

Load the MCR.exe and run it.

This program want some informations about your stepper motor.

Program draw the driver schematics for given motor parameters and give component list If you fill the blank data area.

2) Building step.

Build the given schematics by given component list.

3) Configuration step.

Connect the dir, enb, err and Gnd pins to RS232 port of your computer, apply the hybrid voltages and rerun the MCR.exe

4) Last step.

Press to program button.

Now your motor has ideal driver. Because driver and motor matched.

com/Programlar/MCR.exe

32 microstep low rpm demo film

4 microstep high rpm demo film

MCR1207 read motor currents and calculates pwm value with digital signal processsor in the real time.

MCR1207 electronic hybrid circuit coming soon.

Price? Surprise.

[bunalmis]

Pcbs finished.

Now I am looking cheap coating material for the hybrid circuit.

[bunalmis]

First two cards completed but now i have big problem.
I don't know how I can coat this circuit.

Any idea?

[kreutz]

Originally Posted by bunalmis First two cards completed but now i have big problem. I don't know how I can coat this circuit. Any idea?

Hello;

Try http://www.masterbond.com/produse/produse_pe.html . I will continue searching for other options.

Best regards,

Kreutz.

[kreutz]

More links:
Process info:
http://www.pottingsolutions.com/my%2...Technology.htm

Other providers:
http://www.mgchemicals.com/products/potencap.html

[bunalmis]

Thank you Kreutz,

But I can not find this products in my country.

[kreutz]

Material Property Considerations


1. Cured Epoxy Coefficient of Linear Expansion (CTE) match to Solder Joint interconnects, Sn63Pb37 (21ppm/°C) - Pb95Sn5 (29ppm/°C), 65% to 70% silica filler.
2. High Glass Transition (Tg) to achieve all product storage life temperature requirements (Minimum Cured Epoxy Tg ≥ Substrate Tg; FR4 = 120°C to 135°C, BT/Enhanced FR4 = 170°C to 185°C).
3. High adhesion properties to BCB passivation and to LPI solder masks.
4. Low Ionics < 100ppm total Halides.
5. Low Viscosity and Fast Flow rate, with flow capability to 50mm (2mil) minimum gap size.
6. Low warpage, low shrinkage matrix.
7. Minimal moisture absorption.

[kreutz]

Originally Posted by bunalmis Thank you Kreutz, But I can not find this products in my country.

Hello;

It is not the same encapsulating individual components (resistors and capacitors) as encapsulating a PCB + solder + soldermask + already encapsulated components, the encapsulation/potting process and materials are different.

Why don't you sell the boards without encapsulation? Whoever could reverse engineer your boards could also design them themselves.

Regards,

Kreutz.

[bunalmis]

I want same as hybrid type product.
Professional seem importand for me.

Like this

[kreutz]

Originally Posted by bunalmis I want same as hybrid type product. Professional seem importand for me.

Info: http://www.chipscalereview.com/9803/wong2.htm

Material: http://www.sanyu-rec.jp/e-denzai/den06.html

[bunalmis]

Three MCR1207 hybrids working on the pcb router.

Microstep mode: 10
Current set 1.5A

Video link http://www.bikomak.com/Avi/Pcb_Cnc.wmv

[kreutz]

Congratulations!.

Did you ever get the encapsulation done?

Best regards,

Kreutz.