I am starting a home side business to custom make Mobo & GPU heatsinks and water blocks for computers. Parts to be made CPU coolers/waterblocks, Full Mobo water blocks, VREG blocks, north & south bridges waterblocks/heatsinks, etc...
Keeping in mind that I'm not building a reactor, what copper manufacturing process would be better for these uses (heat absorption/dissipation) in 101 oxygen free copper...
1. extrusion process...3"x3"x3"x?length
2. cold rolled process...3" plate cut to 3"x3"x3"x?length
3. hot rolled...3" plate cut to 3"x3"x3"x?length
Also is there a better material or exotic material for heat absorption/dissipation that can be used for my needs...keep in mind that these coolers will and could be in direct contact with CPU's,GPU's and related components.
any/all help will be greatly appreciated...tyvm
I'm not aware of a huge difference in the differing processes. Although I suppose there may be one.
Silver has slightly higher thermal conductivity (426 vs 401 W/(mK)) but is usually not worth the cost.
Your biggest problem with heat transfer in computer cooling is reducing the layer between the heatsink and the component you are trying to cool. So make sure you have a way of getting a VERY good flat finish on the bottom of your sink (although a lot of IHS aren't flat it's still your best bet).
You also have to watch for restriction in the block as if you have too much you will not have enough pressure to make it to the next component.
One last thing. Remember that you cannot mix metals that will be in contact with the cooling fluid as you will cause galvanic corrosion.
That's about what I remember from my water cooling days. There is not too much call for it anymore (this is coming from a guy running a i7 930 at 4.4Ghz 24/7) as you can't run as much voltage though the components. Although there is still a market it's more for looks then clocks (with the exception of GPU cooling).
Think & Tinker / PreciseBits