PWM Chopper-Type bipolar
Stepping Motor Driver IC
1 V2.1.10 2008-08-24
The THB6064H is a PWM chopper-type sinusoidal micro-step bipolar stepping motor driver IC.
It supports 8 kind of excitation modes and forward/reverse mode and is capable of low-vibration, high-performance drive of 2-phase bipolar type stepping motors using only a clock signal.
Weight: HZIP25-P-1.27: 9.86 g (typ.)
• Single-chip bipolar sinusoidal micro-step stepping motor driver
Weight: HZIP25-P-1.27: 9.86 g (typ.)
• Uses high withstand voltage BiCD process: Ron (upper lower) = 0.4 �� (typ.)
• Forward and reverse rotation control available
• Selectable phase drive (1/2,1/8,1/10, 1/16, 1/20, 1/32, 1/40, 1/64 step)
• High output withstand voltage: VDSS = 50 V
• High output current: IOUT = 4.5 A (peak)
• Packages: HZIP25-P-1.27
• Output monitor pins (DOWN / ALERT)
• Equipped with reset and enable pins
• Built-in thermal shutdown(TSD) and over-current detection(ISD) circuit
*: Since this product has a MOS structure, it is sensitive to electrostatic discharge. These ICs are highly sensitive to electrostatic discharge. When handling them, please be careful of electrostatic discharge, temperature and humidity conditions.
Absolute Maximum Ratings (Ta = 25��C)
Note 1: T = 100ms
Note 2: Ta = 25��C, No heat sink.
Note 3: Ta = 25��C, with infinite heat sink (HZIP25).
Operating Range (Ta = −30 to 85��C)
Electrical Characteristics (Ta = 25��C, VDD = 5 V, VM = 24 V)
Note: Pre-shipment testing is not performed.
Description of Functions
1. Excitation Settings
You can use the M1, M2 and M3 pin settings to configure four different excitation settings. (The default is 2-phase excitation using the internal pull-down.)
Please be sure to set up ��Low�� or ��High�� always at M1, M2 and M3 terminals.
Although M1��M2 and M3 terminals have built-in pull-down resistors, please do not keep M1��M2 and M3 terminals open.
When the ENABLE signal goes Low level, it sets an OFF on the output. The output changes to the Initial mode shown in the table below when the RESET signal goes Low level. In this mode, the status of the CLK and CW/CCW pins are irrelevant.
3. Initial Mode
When RESET is used, the phase currents are as follows.
4. OSC circuit
Oscillating waveform of chopping wave is generated by connecting the capacitor (COSC1A and COSC1B) between OSC1A , OSC1B and GND terminal.
The fixed off-time (TOFF1A and TOFF1B) can be calculated by the following equation:
TOFF1A = COSC1A �� ( 4.4 �� 10-5 ) [sec]
TOFF1B = COSC1B �� ( 4.4 �� 10-5) [sec]
(A gap is between actual values because this is an approximate expression.)
The recommended value for TOFF1A and TOFF1B is from 15��s to 35��s.
The recommended value for COSC1A and COSC1B is from 680pF to 1000pF.
5. Decay mode
By comparing the input voltage of FDT terminal and the OSC chopping wave, the rate of the fast-decay time and the slow-decay time in the mixed-decay mode can be set up.
6. 100% current Settings (Current Value)
100% current value is determined by Vref inputted from external part and the external resistance for detecting output current.
Vref is doubled 1/3 inside IC, and compared with VRS.
Io(100%) = Vref x 1/3 x 1/Rs
The average current is lower than the calculated value because this IC has the method of peak current detection.
7. Thermal Shut-Down circuit
The IC incorporates a thermal shutdown circuit. When the junction temperature (Tj) reaches 170��C (typ.), the output power MOSFETs are turned off.
The output power MOSFETs are turned on automatically.
The IC has 40��C of temperature hysteresis.
TSD = 170��C (target spec) (Note)
��TSD = 40��C (target spec) (Note)
8. ISD (Over current detection)
Current that flow through output power MOSFETs are monitored individually. If over-current is detected in at least one of all output power MOSFETs, all output power MOSFETs are turned off then this status is kept until ENABLE signal is input. Target value in design is 6A and dispersion of ��1.5A should be considered.
ISD = 6A (typ.) ��1.5A (Note)
9. Low voltage detection (UVLO) circuit
Outputs are shutoff by operating at 3.9V (Typ.) of VDD or less.
It has a hysteresis of 0.1V(Typ.) and recover to output when VDD reaches 4.0V(Typ.).
・The state of internal IC when the ULVO circuit is driving
The states of the internal IC, outputs, and the IC after recovery correspond to the enable mode.
10. ALERT output
ALERT pin outputs the state of TSD and ISD. When TSD or ISD circuit operates, ALERT pin state changes from high impedance to low.
VALERT = 0.5V (max.) at 1mA
When IC detects CLK frequency less than 1.5Hz, output of DOWN pin turns to LOW.
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
 The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion.
 Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
 If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
 Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
Weight: 9.86 g (typ.)
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