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I am starting a home side business to custom make Mobo & GPU heatsinks and water blocks for computers. Parts to be made CPU coolers/waterblocks, Full Mobo water blocks, VREG blocks, north & south bridges waterblocks/heatsinks, etc... Keeping in mind that I'm not building a reactor, what copper manufacturing process would be better for these uses (heat absorption/dissipation) in 101 oxygen free copper... 1. extrusion process...3" square x?length 2. cold rolled process...3" plate cut to 3" square x?length 3. hot rolled...3" plate cut to 3" square x?length Also is there a better material or exotic material for heat absorption/dissipation that can be used for my needs...keep in mind that these coolers will and could be in direct contact with CPU's,GPU's and related components. any/all help will be greatly appreciated...tyvm |
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